Breaking the coverage bottleneck: Unifying verification for modern chips cover art

Breaking the coverage bottleneck: Unifying verification for modern chips

Breaking the coverage bottleneck: Unifying verification for modern chips

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Summary

 Harry Foster talks with Vladislav Palfy, Director of Solutions Management at Siemens EDA, about why coverage closure has become one of the biggest bottlenecks in modern verification. Drawing on insights from his white paper, Questa One Unified Coverage Solution: Transforming Verification Through Intelligence, Vladislav explains how traditional brute-force approaches to coverage are struggling to keep up with the complexity of today’s semiconductor designs. Learn how a unified, intelligent approach to coverage—combining planning, automation, and analytics—helps teams break through coverage plateaus, reduce regression effort, and achieve faster, more confident verification closure. Key Discussion Points Why coverage closure is so hard today: How increasing design complexity and fragmented workflows have turned the last 10% of coverage into a major project risk. The coverage plateau problem: Why adding more tests often stops improving coverage—and how intelligent analysis helps teams target the real gaps. Unified coverage explained: How integrating planning, analysis, and execution creates a more systematic and predictable path to verification completeness. The role of the unified coverage database: How a centralized coverage architecture enables collaboration across teams, tools, and geographies. From brute force to intelligent automation: How targeted test generation and coverage analytics dramatically reduce regression workloads. Looking ahead: How AI-driven verification and predictive coverage planning could transform how engineers approach coverage closure in the next generation of chip design.
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